Datacenter immersed in cooling liquid
US9713290B2 · kind B2 · utility
20Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2014 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Jul 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The subject disclosure is directed towards a datacenter or partial datacenter (e.g., a datacenter module) contained in a sealed container. The container may be filled with a cooling fluid, such as a dielectric fluid, to help cool the datacenter components. The container and its internal datacenter or datacenter portion may be submerged in water, in which event the fluid also helps to equalize the external water pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.