Resin mold for nanoimprinting and production method thereof
US9713900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2011 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Mar 25, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2059/023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin mold for nanoimprinting has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0×10−4 to 4.0×10−2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.