Photo-curable resin composition
US9714364B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2012 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Sep 24, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/37
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
There is provided a curable resin composition that exhibits high adhesive properties to materials such as glass, copper, aluminum, PET, and PC, which have been regarded as poor adherends relative to photo-curable compositions, and high adhesive properties also between adherends different from each other. A curable resin composition including a polyene compound of Formula (1):(where n1, n2, and n3 are each independently an integer of 2 to 4; and R1 to R9 are each independently a hydrogen atom or a C1-10 alkyl group). The composition may further include a thiol compound or a photopolymerization initiator. The thiol compound may be a compound having two to six thiol groups in the molecule, or be an aliphatic thiol, or be produced by a reaction of an aliphatic mercapto carboxylic acid and a polyhydric alcohol. The polyhydric alcohol may be an aliphatic polyhydric alcohol or hydroxyalkyl isocyanurate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.