Heat pipe and radiator system with thermoelectric cooler
US9714777B1 · kind B1 · utility
2Cited by
4References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 18, 2014 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Sep 15, 2035 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2321/0252
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal control arrangement includes a first heat pipe and a plurality of thermoelectric coolers. The plurality of thermoelectric coolers is disposed between the first heat pipe and a thermal load, each of the plurality of thermoelectric coolers having a first surface and a second surface, each respective first surface having a first thermally conductive coupling to the first heat pipe and each respective second surface having a second thermally conductive coupling to the thermal load.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.