Systems and methods for full-order equivalent circuit approach (ECA) modeling of layered structures
US9715567B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2015 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Sep 21, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/367
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided for generating an equivalent circuit model. RLGC parameters representing a segment of a layered structure of a specified length are received. The layered structure includes two conductors (also called planes) and at least one trace or a transmission line located between the two conductors. An admittance matrix corresponding to the segment is computed based at least in part on the received RLGC parameters. One or more loading parameters representing a loading of one of the two conductors due to the trace or traces are also computed, and a segment circuit model for the segment of the layered structure based at least in part on the admittance matrix and the one or more loading parameters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.