AMOLED backplane structure and manufacturing method thereof
US9716131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2017 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | Feb 17, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/103
Abstract
A manufacturing method of an AMOLED backplane includes manufacturing a TFT substrate and forming a corrugation structure on the TFT substrate, which includes raised sections and recessed sections alternating each other; coating organic photoresist on the TFT substrate that includes the corrugation structure formed thereon to form a planarization layer in such a way that an upper surface of a portion of the planarization layer corresponding to and located above the corrugation structure includes a curved configuration corresponding to the corrugation structure; forming a pixel electrode on the planarization layer in such a way that the pixel electrode shows a curved configuration; and forming, in sequence, a pixel definition layer that has an opening to expose the curved configuration and a photo spacer on the pixel electrode and the planarization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.