Light-emitting diode package
US9716214B2 · kind B2 · utility
0Cited by
41References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2016 |
| Grant date | Jul 25, 2017 |
| Priority date | — |
| Expiry date | May 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/831
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED package includes a substrate, a light-emitting structure provided on the substrate, an electrode structure provided on the light-emitting structure, and an external connection terminal provided on the electrode structure, the external connection terminal comprising a major axis and a minor axis. The major axis of the external connection terminal is perpendicular to a cleaving plane of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.