Optoelectronic component including exposed contact pad

US9716247B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Simon Schicktanz · Regensburg, DE
• Philipp Schwamb · Regensburg, DE
• Evelyn Trummer-Sailer · Mintraching, DE

Key dates

• Filing date: Sep 25, 2013
• Grant date: Jul 25, 2017
• Expiry date: Sep 25, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

Various embodiments may relate to an optoelectronic component, including a carrier, a planar, electrically active region on or above the carrier; an adhesion layer on or above the electrically active region, wherein the adhesion layer at least partly surrounds the electrically active region, a cover on or above the adhesion layer, wherein a part of the adhesion layer is exposed, and an encapsulation on or above the exposed adhesion layer, wherein the encapsulation is formed from an inorganic substance or substance mixture. Further various embodiments may relate to a method for producing an optoelectronic component.