Circuit board made of AIN with copper structures

US9717149B2 · kind B2 · utility

Assignee

• CERAMTEC GMBH · DE

Inventors

• Alexander Dohn · Memmelsdorf, DE
• Roland Leneis · Marktredwitz, DE
• Klaus Herrmann · Nuremberg, DE
• Dietmar Jähnig · Bindlach, DE

Key dates

• Filing date: Oct 31, 2012
• Grant date: Jul 25, 2017
• Expiry date: Apr 22, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49165
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with N2 while controlling oxygen at 0-50 ppm O2, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with N2 while keeping the oxygen content at 0-50 ppm O2.