Conductive grid sensor for smart packaging
US9717653B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Feb 12, 2015 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Mar 1, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG16H20/13
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A blister packaging including a blister card including a plurality of flexible blisters; and a backing sheet including blister backing portions and backing securing portions, wherein when the backing securing portions are secured to the blister card, the blister backing portions are aligned to each blister forming a plurality of compartments adapted to store a medicament, and wherein the backing includes two or more conductive first leads affixed to the backing, two or more conductive second leads affixed to the backing, and a plurality of conductive zones, wherein each conductive zone electrically connects one of the first leads to one of the second leads, and wherein each blister backing portion includes a conductive zone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.