Conduit and method of forming
US9717874B2 · kind B2 · utility
9Cited by
91References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2015 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Jun 25, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/139
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thin ribbon spirally wound polymer conduit and method of forming, wherein a helical reinforcing bead is interposed adjacent overlapping layers of ribbon. Further, a method of continuously forming spirally wound conduit wherein a sacrificial layer, preferably having a different base polymer to that of the conduit, is first applied to the former before the conduit is formed overtop.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.