Package integrity feature for packaging
US9718585B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2014 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Feb 28, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D2575/586
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A reclosable package is described that includes a package integrity feature defined by an inner film layer of the package. The package integrity feature includes a first die cut portion and a second die cut portion that both extend from a main die cut portion at least partially defining the opening of the package. The first and second die cut portions are continuous with each other and with the main die cut portion, such that they are defined by a single cut line. In some cases, the package integrity feature includes a neck region that tears when the package is opened and an anchor region that resists delamination. Because the first and second die cut portions are continuously formed with each other, the anchor region may have a circular or elliptical shape and is, thus, easier and more consistently manufactured, allowing for better performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.