Injection-molded body
US9718955B2 · kind B2 · utility
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4References
13Claims
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Key dates
| Filing date | Jun 19, 2012 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Jun 8, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1397
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An injection molded article containing a resin composition containing a polyamide compound (A) and a resin (B), wherein the polyamide compound (A) contains from 25 to 50% by mol of a diamine unit, which contains a particular diamine unit, in an amount of 50% by mol or more; from 25 to 50% by mol of a dicarboxylic acid unit, which contains a particular dicarboxylic acid unit, in an amount of 50% by mol or more; and from 0.1 to 50% by mol of a particular constitutional unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.