Method of manufacturing deposition mask
US9719163B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2015 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Jan 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing a deposition mask is disclosed. In one aspect, the method includes depositing a first photoresist layer on a substrate, aligning a first photomask over the first photoresist layer and developing the first photoresist layer to form a plurality of first photoresist patterns having sides that gradually narrow toward the substrate. The method also includes forming a metal layer over the first photoresist patterns and a portion of the substrate exposed by the first photoresist patterns, depositing a second photoresist layer over the metal layer and aligning a second photomask over the second photoresist layer and developing the second photoresist layer to form a plurality of second photoresist patterns between the first photoresist patterns. The method further includes etching the metal layer to form a pattern hole, removing the first and second photoresist patterns and separating the substrate so as to form a deposition mask.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.