Photodefined aperture plate and method for producing the same
US9719184B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 23, 2011 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | May 23, 2034 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61M2207/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.