Patent · US Active

Thermoplastic molding composition

US9721695B2 · kind B2 · utility

0Cited by

1References

9Claims

0Family size

Assignee

BASF SE

Inventors

Cecile Gibon · Mannheim, DE
Xin Yang · 浮桥镇, CN
Christof Kujat · Neustadt, DE
Martin Weber · Maikammer, DE
Laszlo Szarvas · Ludwigshafen, DE
Daniel J. Klein · Brookline, US
Petra Poetschke · Dresden, DE
Beate Krause · Overath, DE

Key dates

Filing date	Dec 21, 2011
Grant date	Aug 1, 2017
Priority date	—
Expiry date	Jun 16, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB82Y30/00
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

The thermoplastic molding composition comprises, based on the thermoplastic molding composition,

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.