Method for manufacturing silica layer, silica layer, and electronic device
US9721785B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jun 9, 2016 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Jun 9, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/62
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a silica layer includes: coating a pre-wetting liquid material including a carbon compound on a substrate; coating a composition for forming a silica layer on the substrate coated with the pre-wetting liquid material; and curing a substrate coated with the composition for forming a silica layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.