Method of transferring micro-device
US9721823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2016 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Aug 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the electrodes, and a plurality of micro-devices disposed on the electrodes, including a first micro-device and a second micro-device, are also provided. A voltage is applied to an electrode corresponding to the first micro-device, so that an electrostatic force generated on the first micro-device by the carrying unit is larger than a force generated on the second micro-device by the carrying unit. A transfer stamp contacts the first micro-device and the second micro-device, and moves when the transfer stamp contacts the first micro-device and the second micro-device and the electrostatic force is greater than the force generated by the carrying unit, so that the second micro-device is picked up by the transfer stamp and transferred to a receiving unit, and the first micro-device remains on the carrying unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.