Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9721825B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2016 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Apr 12, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.