Electronic package with corner supports
US9721906B2 · kind B2 · utility
2Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2015 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Aug 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package that includes a substrate and a die attached to the substrate. A plurality of supports attached to the substrate adjacent to the die. At least one support in the plurality of supports is positioned adjacent to at least one corner of the die such that the at least one corner of the die is positioned adjacent to the at least one support. Other example forms relate to a method of fabricating an electronic package. The method includes securing a die to a substrate and securing a plurality of supports to the substrate such that at least one support is adjacent to at least one corner of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.