Package method of substrate and package structure
US9722004B2 · kind B2 · utility
0Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2016 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Aug 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/874
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a substrate and a package plate. A frame is formed of a seal glue arranged between the substrate and the package plate. An underfill is positioned inboard of the frame. The package plate has a spreading surface, and at least one groove is formed in a spreading path of the frame on the spreading surface of the package plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.