Optoelectronic semiconductor chip and method for producing optoelectronic semiconductor chips

US9722136B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Karl Engl · Niedergebraching, DE
• Markus Maute · Alteglofsheim, DE
• Stefanie Rammelsberger · Zeitlarn, DE
• Anna Kasprzak-Zablocka · Donaustauf, DE

Key dates

• Filing date: Apr 14, 2016
• Grant date: Aug 1, 2017
• Expiry date: Apr 14, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8314

Abstract

An optoelectronic semiconductor chip has a semiconductor body and a substrate on which the semiconductor body is disposed. The semiconductor body has an active region disposed between a first semiconductor layer of a first conductor type and a second semiconductor layer of a second conductor type. The first semiconductor layer is disposed on the side of the active region facing the substrate. The first semiconductor layer is electrically conductively connected to a first termination layer that is disposed between the substrate and the semiconductor body. An encapsulation layer is disposed between the first termination layer and the substrate and, in plan view of the semiconductor chip, projects at least in some regions over a side face which delimits the semiconductor body.