Method for manufacturing electronic device
US9722213B2 · kind B2 · utility
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3References
11Claims
0Family size
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Key dates
| Filing date | Mar 27, 2012 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Nov 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/173
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
When a coating film 4 is formed on a substrate 1, on which elements 3 are formed, by an ALD film forming method or the like, the coating film 4 is partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substrate 1 partially with a partially coating member 2, a step of forming the elements 3 on the substrate 1, a step of forming the coating film 4 on the substrate 1 to cover the elements 3 and the partially coating member 2, and a step of forming a crack 4A in the coating film 4 on the partially coating member 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.