Method for fabricating a flexible electronic structure and a flexible electronic structure
US9723711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2015 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Aug 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0154
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.