Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides
US9723766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2011 |
| Grant date | Aug 1, 2017 |
| Priority date | — |
| Expiry date | Aug 22, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.