Apparatus and process for cutting adhesive labels
US9724837B2 · kind B2 · utility
0Cited by
47References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2015 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Oct 14, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1994
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus are provided for die cutting label stock comprising a facestock, an adhesive and optionally a liner to form labels where a liner of the linered pressure sensitive adhesive label stock may be a thin or ultrathin liner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.