Processing method for constraining lower melting point metals within ceramic laminates during sintering
US9724897B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Jan 7, 2015 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Apr 19, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/68
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is described. The method is a method for making a constraining ceramic assembly. The method includes applying at least one metallic electrode to a substrate. The method also includes applying a porous ceramic layer to the substrate to cover the metallic electrode. The method also includes sintering the substrate, the porous ceramic layer, and the metallic electrode together at a sintering temperature above a melting point of the metallic electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.