Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, CMP polishing pad and process for preparing said composition

US9725621B2 · kind B2 · utility

Assignee

• Cabot Corporation · US

Inventors

• Qingling Zhang · Emerald Hills, US
• Bennett Greenwood · Somerville, US
• Ravi Sharma · Fairport, US
• Geoffrey D. Moeser · Groton, US
• Brian G. Prevo · Portland, US
• Mark J. Hampden-Smith · Albuquerque, US

Key dates

• Filing date: Apr 30, 2014
• Grant date: Aug 8, 2017
• Expiry date: Apr 30, 2034

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09K3/1463
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

CMP processes, tools and slurries utilize composite particles that include core particles having organosilica particles disposed about the core particles. Using these processes, tools and slurries can enhance removal rates, reduce defectivity and increase cleanability with respect to comparable systems and substrates.