Method and apparatus for using light emitting diodes for curing
US9726435B2 · kind B2 · utility
8Cited by
200References
9Claims
0Family size
Inventor
Key dates
| Filing date | Jan 24, 2005 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Nov 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method and apparatus for using light emitting diodes for curing in various applications. The method includes a novel method for cooling the light emitting diodes and mounting the same on heat pipe in a manner which delivers ultra high power in UV, visible and IR regions. Furthermore, the unique LED packaging technology of the present invention that utilizes heat pipes performs far more efficiently in much more compact space. This allows much more closely spaced LEDs operating at higher power and brightness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.