Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope
US9726689B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2013 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Nov 6, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0865
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to sensors, and more particularly, a sensor device having accelerometer and gyroscope integrated into a low cost compact package. The device includes: MEMs wafer; and an ASIC wafer bonded to the MEMs wafer; a wafer-level-package redistribution layer (WLP RDL) formed on a surface of the ASIC wafer; and a ball grid array having a plurality of solder balls that electrically connect the package to a circuit board. The MEMs wafer includes the accelerometer and gyroscope, while the ASIC wafer includes two separate cavities corresponding to the accelerometer and gyroscope, respectively. The ASIC wafer includes electrical circuits/components to process the readout signals received from the accelerometer and gyroscope.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.