Suspension pad for head-gimbal assembly that inhibits formation of an inter-pad solder bridge
US9728211B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2016 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Feb 4, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4853
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Devices including a suspension pad shape and layout that avoids shorts caused by solder bridging during coupling of leads thereto. One embodiment includes a plurality of slider pads and a plurality of suspension pads being generally aligned with the slider pads. A conductive material electrically couples each of the suspension pads to the slider pad aligned therewith. At least one of the suspension pads is characterized as follows. The suspension pad has a proximal edge positioned closest to the associated slider pad, a distal edge positioned opposite the proximal edge, and side edges extending between the proximal and distal edges. At least a portion of the suspension pad tapers toward the proximal edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.