Patent · US Active

Evaporation source

US9728382B2 · kind B2 · utility

0Cited by

3References

24Claims

0Family size

Assignee

Oerlikon Surface Solutions AG, Pfäffikon · CH

Inventors

Joerg Vetter · Bensberg, DE
Stefan Esser · Aachen, DE
Juergen Mueller · Berlin, DE
Georg Erkens · Aachen, DE

Key dates

Filing date	Jan 24, 2014
Grant date	Aug 8, 2017
Priority date	—
Expiry date	Aug 19, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/3497
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Evaporation source, in particular for use in a sputtering process or in a vacuum arc evaporation process, preferably a cathode vacuum arc evaporation process. The evaporation source includes an inner base body which is arranged in an outer carrier body and which is arranged with respect to the outer carrier body such that a cooling space in flow communication with an inlet and an outlet is formed between the base body and the carrier body. In accordance with the invention, the cooling space includes an inflow space and an outflow space, and the inflow space is in flow communication with the outflow space via an overflow connection for the cooling of the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space the overflow connection and the outflow space to the outlet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.