Manufacturing method of a condenser microphone
US9729990B2 · kind B2 · utility
0Cited by
11References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2015 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Mar 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2231/001
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.