Ceramic printed circuit board comprising an al cooling body
US9730309B2 · kind B2 · utility
2Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2012 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Oct 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.