Patent · US Active

Metal-ceramic substrate

US9730310B2 · kind B2 · utility

2Cited by

6References

13Claims

0Family size

Assignee

ROGERS GERMANY GMBH · DE

Inventors

Andreas Meyer · Speichersdorf, DE
Christoph Wehe · Bremen, DE
Jurgen Schulz-Harder · Achern, DE
Karsten Schmidt · San Diego, US

Key dates

Filing date	Feb 13, 2013
Grant date	Aug 8, 2017
Priority date	—
Expiry date	Jun 6, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/266
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.