Mating backplane for high speed, high density electrical connector
US9730313B2 · kind B2 · utility
12Cited by
28References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2015 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Nov 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.