Display panel motherboard and manufacturing method thereof
US9730331B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Jun 18, 2014 |
| Grant date | Aug 8, 2017 |
| Priority date | — |
| Expiry date | Jan 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A display panel motherboard and a manufacturing method thereof are provided. The display panel motherboard comprises display panel regions (Q1) spaced apart from each other and precut regions (Q2) adjacent to the display panel regions. The manufacturing method comprises forming an electrical insulating layer (102); and removing at least portions of the electrical insulating layer provided on the precut regions (Q2). The method avoids the problem of other patterns offset on the display panel motherboard caused by the larger internal stress within the electrical insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.