Patent · US Active

Heat sink apparatus and method for power semiconductor device module

US9730365B2 · kind B2 · utility

2Cited by

6References

18Claims

0Family size

Assignee

General Electric Company · US

Inventors

Alvaro Jorge Mari Curbelo · Unterschleißheim, DE
Simon Schoewel · Garching bei München, DE
Tiziana Bertoncelli · Munich, DE

Key dates

Filing date	Dec 27, 2013
Grant date	Aug 8, 2017
Priority date	—
Expiry date	Dec 27, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A heat sink has a base plate that has a first central portion, a second central portion, and a periphery, a first plurality of heat pipes embedded in the base plate that are arranged to convey heat away from the first central portion, and a second plurality of the heat pipes embedded in the base plate that are arranged to convey heat away from the second central portion, each of the heat pipes of the first and second pluralities having a hot end for receiving heat flow and a cool end for releasing heat flow. A switch package comprises an inner casing half mounted to a module facing surface of the heat sink base plate, a semiconductor module mounted to the module facing surface of the heat sink within the inner casing half, and an outer casing half that encloses the heat sink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.