Substrate peeling apparatus and method of peeling substrate using the same
US9731492B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 2, 2014 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Oct 18, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate peeling apparatus includes a support member and absorption pads. The support member, having a quadrangular shape, includes first and second vertexes diagonally facing each other in a first direction, and third and fourth vertexes diagonally facing each other in a second direction crossing the first direction. The absorption pads is disposed on the support member. The absorption pads are arranged in rows in a direction parallel to the first direction and at least one absorption pad of each row is arranged in a direction parallel to the second direction. An absorption pad of each row includes a hole having an increasing internal diameter as a distance in the first direction between the each row and the first vertex increases. An internal diameter of an absorption pad in a row positioned halfway between the first and second vertexes has a maximum internal diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.