MEMS-CMOS-MEMS platform
US9731961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Jul 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A package combining a MEMS substrate, a CMOS substrate and another MEMS substrate in one package that is vertically stacked is disclosed. The package comprises a sensor chip further comprising a first MEMS substrate and a CMOS substrate with a first surface and a second surface and where the first MEMS substrate is attached to the first surface of the CMOS substrate. The package further includes a second MEMS substrate with a first surface and a second surface, where the first surface of the second MEMS substrate is attached to the second surface of the CMOS substrate and the second surface of the second MEMS substrate is attached to a packaging substrate. The first MEMS substrate, the CMOS substrate, the second MEMS substrate and the packaging substrate are provided with electrical inter-connects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.