Micromechanical component with a reduced contact surface and its fabrication method
US9731964B2 · kind B2 · utility
1Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2016 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Jun 2, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0198
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a silicon-based component with at least one reduced contact surface which, formed from a method combining at least one oblique side wall etching step with a “Bosch” etch of vertical side walls, improves, in particular, the tribology of components formed by micromachining a silicon-based wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.