Modified polyamide composition
US9732222B2 · kind B2 · utility
2Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2010 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Jun 24, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G69/48
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A sulfonated aliphatic or aromatic compound for the production of a modified polyamide that can significantly increase the glass transition temperature of the polyamide is described. A polyamide composition including at least: one polyamide modified by a sulfonated compound, the compound being chemically bonded to the polymer chain of the polyamide; and reinforcing or filling agents is also described. The composition can be a composition to be molded, for example, in the form of granules or powder, to be used in the production of articles using an injection molding method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.