Conductive paste and method for producing conductive film using same
US9732236B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2014 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Dec 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 μm, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 μs and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.