Low-melting elemental metal or fusible alloy encapsulated polymerization initiator for delayed initiation
US9732266B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Nov 18, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Feb 9, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K8/40
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An encapsulated composition for polymerization includes an initiator composition for initiating a polymerization reaction, and a capsule prepared from an elemental metal or fusible alloy having a melting temperature from about 20° C. to about 200° C. A fluid for polymerization includes the encapsulated composition and a monomer. When the capsule melts or breaks open, the initiator is released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.