Testing method for semiconductor manufacturing equipment
US9733273B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The time required to test an electronic device mounted in semiconductor manufacturing equipment can be reduced. A first test panel mounted, on a first connector surface thereof, with plural first test-object connectors respectively including plural first terminals electrically coupled to an electronic device and a second test panel mounted, on a second connector surface thereof, with plural second test-object connectors respectively including plural spring probes are provided. The first connector surface of the first test panel and the second connector surface of the second test panel are positioned to face each other, the spring probes included in the second test-object connectors are electrically coupled to the first terminals included in the first test-object connectors, and a functional test concerning an electrical characteristic of the electronic device is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.