Resin composition, printed circuit board using the composition, and method of manufacturing the same
US9733565B2 · kind B2 · utility
0Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2014 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Nov 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.