Wiring substrate, semiconductor device and method for manufacturing semiconductor device
US9735099B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2016 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Dec 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate used for improvement in manufacturing efficiency of a semiconductor device includes a support body having transparency; an adhesive layer disposed on a main surface of the support body, the adhesive layer including a peeling layer which contains a third resin which is decomposed by light irradiation and a protective layer which is disposed on the peeling layer and contains a fourth resin; and a laminate disposed on the adhesive layer, the laminate including a first resin layer, a second resin layer disposed on the first resin layer, and a wiring pattern disposed at least between the first resin layer and the second resin layer. Accordingly, the semiconductor chip and the wiring substrate which is the external connection member can be separately manufactured, thereby improving manufacturing efficiency of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.