Electrostatic discharge protection for a balun
US9735145B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | May 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die is mounted in an integrated circuit package. The die includes a balun circuit and an electrostatic discharge (ESD) circuit coupled to a ground of the integrated circuit die. The package has a first output pin coupled to a first terminal of the balun and has a second output pin coupled to a second terminal of the balun through first and second bond wires. The second output pin is connected to board ground. A third bond wire is disposed between the second package terminal and the ESD circuit to provide a safe discharge path through the third bond wire for ESD events affecting the first and second output terminals. Thus, a charge that builds up involving one of the output terminals coupled to the balun can be safely dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.