Headphone suspension system
US9736571B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 9, 2015 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | Nov 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headphone suspension system includes a headband assembly, a first earcup and a first suspension assembly elastically coupling the first earcup to a first end of the headband assembly. The headphone suspension system further includes a second earcup and a second suspension assembly elastically coupling the second earcup to a second end of the headband assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.