Method and device for heating electronic component and electronic apparatus using the same
US9736887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2012 |
| Grant date | Aug 15, 2017 |
| Priority date | — |
| Expiry date | May 1, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/206
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a method and a device for heating an electronic component and an electronic apparatus using the method/device. A heater is disposed at the electronic component. The heating method includes following steps: driving the heater according to a duty ratio by using electrical energy of a power module. If the output voltage of the power module is greater than a first threshold, set the duty ratio as a first ratio. If the output voltage of the power module is less than a second threshold, set the duty ratio as a second ratio. If the output voltage of the power module is between the first threshold and the second threshold, adjust the duty ratio so that the difference between the output voltage of the power module and the second threshold is positively proportional to the duty ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.